Atmal DC saçt rma ile haz rlanan Cr/n Si Schottky engel diyotunun seri direnç ve arayüzey durum yo unlu u özellikleri - PDF

DUFED, 2(1), 9-15, 2013 Atmal DC saçt rma ile haz rlanan Cr/n Si Schottky engel diyotunun seri direnç ve arayüzey durum yo unlu u özellikleri Ahmet Tombak a, Yusuf Selim Ocak b*, Tahsin K l ço lu a,c a

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DUFED, 2(1), 9-15, 2013 Atmal DC saçt rma ile haz rlanan Cr/n Si Schottky engel diyotunun seri direnç ve arayüzey durum yo unlu u özellikleri Ahmet Tombak a, Yusuf Selim Ocak b*, Tahsin K l ço lu a,c a Department of Physics, Faculty of Art & Science, Batman University, Batman, Turkey b Department of Science, Faculty of Education, Dicle University, Diyarbakir, Turkey c Department of Physics, Faculty of Science, Dicle University, Diyarbakir, Turkey Özet Atmal DC saçt rma yöntemi ile bir Cr/n Si Schottky engel diyotu elde edildi. Diyota ait idealite faktörü, engel yüksekli i ve seri direnç gibi elektriksel parametreler Cheung ve Norde taraf ndan önerilen fonksiyonlarla belirlendi. Diyotun 1,07 idealite faktörü ve 0,60 ev engel yüksekli ine sahip oldu u görüldü. Diyotun arayüzey durum yo unluk da l m ak m gerilim (I V) verileri kullan larak hesapland. Ayr ca, diyotun kapasite gerilim (C V) ve kapasite frekans (C f) özellikleri analiz edildi. Anahtar Sözcükler: Atmal DC saçt rma, Schottky diyot, Seri direnç, Arayüzey durum yo unlu u, Engel yüksekli i The series resistance and the interface state density properties of a Cr/n Si Schottky barrier diode prepared by pulsed DC sputtering Abstract A Cr/n Si Schottky barrier diode was obtained by pulsed DC sputtering technique. The electrical parameters of the diode such as ideality factor, barrier height and series resistance values were determined using the functions proposed by Cheung and Norde. It was seen that the diode has an ideality factor of 1.07 and a barrier height of 0.60 ev. The interface state density distribution of the diode was calculated using the current voltage (I V) data. In addition, the capacitance voltage (C V) and the capacitance frequency (C f) characteristics of the diode were analyzed. Keywords: Pulsed DC sputtering, Schottky diode, Series resistance, Interface state density, Barrier height * Corresponding author:( 9 1.Introduction Rectifying metal semiconductor (MS) contacts are the common devices in technology and the most widely used in the electronic industry. Much of semiconductor electronic devices such as solar cells, field effect transistors, frequency multipliers and mixers, microwave diodes and photo detectors are the basic structures using Schottky barrier diodes (SBDs) [1-4]. Their electrical characteristics should be well understood owing to the technological importance. Despite one's attentive fabrication, SBDs possess a thin interfacial native oxide layer between the metal and the semiconductor and this thin native oxide layer converts metal semiconductor contacts to metal insulator semiconductor (MIS) devices [5]. Barrier height (BH) which is the energy separation between the Fermi level and the edge of the majority carrier band at the interface is the most characteristic parameter of a metal semiconductor contact [4-6]. In a MS system, the formation of the BH is determined by the Fermi level within the semiconductor band gap [7,8]. Usually, the forward bias current voltage (I-V) characteristics show linear dependencies in the semi logarithmic scale at low voltages but deviate considerably from linearity because of some effects of parameters such as the series resistance R S, the interfacial layer and the interface states at sufficiently large applied voltage [9,10]. While parameters such as the ideality factor (n) and the barrier height (Φ b ) are effective in both the linear and nonlinear regions of these characteristics, accompanying the change of the Schottky barrier height (SBH), the parameter RS is only effective in the downward curvature region (non linear region) of the forward I V characteristics at sufficiently high applied voltage [11,12]. Many metallization methods have been used in the fabrication of MS diodes including thermal evaporation, e beam evaporation, magnetron sputtering and electrochemical deposition techniques [4, 13-15]. Pulsed DC magnetron sputtering method have recently attracted lots of attention owing to their higher deposition rate, capability of inhibiting arc discharge to enhance plasma density to rise the ionization energy with improved coating efficiency [16-18]. The aim of this work is to fabricate a Cr/n-Si MS structure using pulsed DC sputtering method and determine the series resistance and interface state density properties of the junction using the current voltage (I -V) data. Furthermore, the capacitance voltage (C -V) and the capacitance frequency (C-f) properties of the device are examined. 2. Experimental procedures The Cr/n--Si Schottky barrier diode was prepared using one side polished n--si wafer with (100) orientation and 1-10 cm resistivity. The wafer was boiled in trichloroethylene and exposed to ultrasonic vibration in acetone and isopropanol for 5 minutes to remove organic contaminations prior to formation of structures. The wafer was dipped into solution of H 2 O/HF (10:1) for 30 s in order to remove native oxide layers on the surfaces and form H terminated surfaces. Preceding each step, the wafers were rinsed in 18 M deionized water. After the cleaning procedures, the wafers were dried under N 2 atmosphere. To make an ohmic back contact, gold (Au) was sputtered on the unpolished side of n-si substrate and the structure was annealed at C for 15 minutes under N 2 atmosphere. After formation of the ohmic back contact, the native oxide layer formed during previous processes was removed by solution of H 2 O/HF (10:1) and dried under N 2 atmosphere. The structure was then immediately loaded into a vacuum chamber. Cr/n--Si/Au Schottky barrier diode was formed by pulsed DC sputtering of Cr on Si substrates. The sputtering details are listed in the table 1 and the diode diameter was 1.5 mm. The I--V measurement of the diode was performed by Keithley 2400 sourcemeter in dark and the C --V and the C--f measurements were executed by Agilent 4294A impedance analyzer. 10 where k is the Boltzmann constant, T is the absolute temperature, q is the electronic charge, V is the applied voltage, A is the diode area and A* is the Richardson constant equal to 110 Acm 2 K 2 for n Si. The plots of dv/dlni I and H(I) I of the diode are shown in Fig 2. Both plots give straight lines in the series resistance region as expected. The Rs and n(kt/q) values are determined from the slope and the y axis intercept of the graph dv/d(ln I) I, respectively. Similarly, the Rs and Φb values are obtained from the slope and the y axis intercept of the H(I) I graph, respectively. Checking the consistency of the method, the series resistances obtained from both dv/d(ln I) I and H(I) I plots are used. The ideality factor and the barrier height values of Cr/n Si diode were found to be 1.07 and 0.60 ev using the dv/dlni I and H(I) I plots, respectively. For an ideal diode, the ideality factor should be unity. When the image force lowering take into account the ideality factor is around The calculated ideality factor is higher than the ideal case may be caused by the effects of the very thin oxide layer at the interface. The calculated Rs values of the diode were as 29.4 and 28.9 from y axis intercepts of dv/dlni I and H(I) I plots, respectively. Table 1. Pulsed DC sputtering parameters for Cr/n Si Schottky diode Sputtering Parameters Values Lowest Pressure 3x10 6 Torr Pressure during sputtering 5x10 3 Torr Distance between target to wafer Bias to substrate 10 cm 0W Bias to target 100 W Sputter time 15 min DC pulse frequency 5 khz Gas introduced the system Argon 3. Results and discussion 3.1. Series Resistance Determination of Cr/n Si Schottky Diode The I V characteristics of the Cr/n Si Schottky barrier diode at room temperature in dark are displayed in Fig. 1. The diode has a good rectifying behavior as shown in the figure 1. The deviation of I V characteristics from the linear region at high voltages is due to the series resistance and the interface states at MS interface. When the series resistance is taken into account the electrical properties of MS diodes can be calculated using the well known Cheung method expressed as follows [18] (1) and (2) Figure 2 Plots of dv/dlni I and H(I) I for Cr/n Si Schottky diode Figure 1. Semilog I V plot of Cr/n Si Schottky diode 11 The barrier height and the series resistance of a MS can be also determined using the method proposed by Norde [19] F (V ) = V 1 I(V ) 2 β AA*T 2 and series resistance of the diode using Norde functions are a bit lower than the values obtained from the Cheung functions. The differences can be attributed to the nature of the applied methods. (3) Furthermore, the plots of series resistance as a function of voltage at different frequencies are shown in Fig.4. The observed peaks might be related to the interface states [20]. The peak intensity is reduced with an increase in frequency, confirming that the distribution of density of interface states varies from lower to higher frequencies. The peaks are disappeared at high frequencies. This indicates that the interface states cannot follow the fast alternating current signal. where I(V) is the current obtained from I--V data and β is the described as q/kt. After determining the minimum value of F vs. V plot, the barrier height can be calculated from the equation, φ b = F(V0 ) + V0 kt 2 q (4) 100 khz 200 khz 500 khz 1 MHz 2 MHz 5 MHz Series Resistance ( ) where F(V0) is the minimum value of F vs. V and V0 is the corresponding voltage value. The figure 3 depicts the F(V) V graph of the Cr/n Si Schottky diode. The series resistance (Rs) of the contact can be defined through the relation, F(V0 )=0.55 V V0 =0.11 V φb =0.57 ev RS = Figure 4. Rs V measurements for Cr/n Si Schottky diode at various frequencies 3.2. Analysis of Interfacial Properties of Cr/n Si Schottky Diode Figure 3. F vs. V graph for Cr/n Si Schottky diode RS = kt (2 n ) qimin For a real MS contact presenting interface states, the ideality factor n becomes greater than unity. The relation between the ideality factor and the interface state density (NSS) was proposed by Card and Rhoderick as [21], (5) where Imin is the corresponding current value at V0. The F(V0) and V0 values were determined as 0.55 V and 0.11 V, respectively. The Φb and Rs values were calculated as 0.57 ev and 23.1, respectively. The calculated barrier height 1 ε ε NSS = i ( n (V ) 1) S q δ W 12 (6) where W is the space charge width, S and i are the permittivity of the semiconductor and the This will occur when the time constant is too long to permit the charge to move in and out of the states in response to an applied signal [5,21,24]. These situations are clearly shown in the figure 6a. The C V characteristics of the diode can be analyzed by the following relation [5] interfacial layer respectively, is the thickness of the interfacial layer and n(v) the voltage dependent ideality factor value. For the n type semiconductors, the interface states energy (Ess) with respect to the bottom of conduction band at the surface of the semiconductor is given by [22,23] E C E SS = qφ e qv 1 2(Vbi + V ) = 2 C2 A εsqn d (7) where Vbi is the built in potential, εs is the dielectric constant of semiconductor ( εs =11.8) and Nd is the donor concentration. In order to determine Vbi and Nd values for the diode, C-2 --V of the diode at 500 khz was plotted in Fig.6b. The Vbi and Nd values were determined to be 0.40 ev and 4.56x1015 cm-3, respectively. The barrier height Φb of the diodes can be determined by the following relation [5] where V is the voltage drop across the depletion layer and Φe is the effective barrier height. From experimental data of the forward bias I--V plot, the energy distribution curve of the interface states can be extracted. The NSS variation against EC -- ESS was calculated by substituting the voltage dependent n (V) values and the other parameters in Eq.7 as sketched in figure 5 As seen from the figure, the energy distribution of interface states of Cr/n--Si Schottky diode varies from 1.79x10 14 to 1.1x1013 ev-1cm n 100 khz 200 khz 500 khz 1 MHz 2 MHz 5 MHz The capacitance voltage (C V) measurements of the diode at various frequencies are plotted in Fig.6a. If the capacitance voltage measurements are carried out at sufficiently high frequencies, the charge at the interface states cannot follow an alternating current (AC) signal. Capacitance (F) 10.0n 3.3. The Capacitance voltage and the Capacitance frequency Properties of Cr/n Si Diode 8.0n 6.0n 4.0n 2.0n x x1019 φb =0.68 ev 2.0x1019 C-2 (F-2) 1.5x1014 Nss (ev-1 cm-2) (8) 1.0x1014 Nd =4.56 x x x x x EC -ESS (ev) Figure 5. Interface state density distribution of Cr/n Si Schottky diode Figure 6 a) C V measurements at various frequencies and b) C 2 V plot at 500 khz for Cr/n Si Schottky diode 13 the alternating current signal at higher frequencies. This suggests that the contribution of the interface states capacitance to the total capacitance is small which may be neglected [26,27]. Therefore, the values of the capacitance at the high frequency region are only the space charge capacitance [28]. 2.5n 0,1 V 0,2 V 0,4 V Capacitance (F) 2.0n 1.5n 1.0n 4. Conclusions 500.0p 10k 100k 1M A Cr/n Si MS contact was fabricated using pulsed DC sputtering process. It was revealed that the contact has a good rectification with 1.07 ideality factor and 0.60 ev barrier height values. The series resistance values of the diode from were calculated as 29.4 and 28.9 Cheung functions and 23.1 from Norde functions. Series resistance versus voltage measurements at different frequencies implies the effects of interface states on the electrical properties of the diode. The interface state density distribution of the diode was determined using the current voltage data. In addition, the capacitance voltage and the capacitance frequency properties of Cr/n Si diode were measured. It was also seen that the barrier height value obtained from the current voltage measurements is 0.08 ev smaller than the value obtained from the capacitance voltage measurements. 10M Freequency (Hz) Figure 7. C f measurements of the diode between 10 khz to 10 MHz φ b (C V ) = Vbi + Vp (9) where Vp is the potential difference between the bottom of the conduction band in the neutral region of n--si and the Fermi level. The Vp value for n--si can be calculated when the carrier concentrations Nd is known. The value of Vp has been calculated as ev for n--si semiconductor. Therefore, the barrier height value of Cr/n--Si MS diode were calculated as 0.68 ev calculated using Eq. (9). A discrepancy in Φb of 0.08 ev is observed between the results obtained from I--V and C--V plots. This discrepancy may be due to the presence of the thin native oxide between the metal and the semiconductors. The existence of barrier height inhomogeneity can be another explanation [25]. References Moreover, Fig.7 presents the capacitance frequency (C--f) measurements of Cr/n--Si Schottky barrier diode between 10 khz to 10 MHz at different voltages. As seen from the figure, the capacitance decreases with an increase in frequency and then remains nearly constant. The higher capacitance values of the diode at lower frequencies show the excess capacitance resulting from the interface states in equilibrium with the n Si that can follow the AC signal [26 28]. It means that while the interface states at lower frequencies follow the alternating current signal, they cannot follow A. Maestrini, B. Thomas, H. Wang, C. Jung, J. Treuttel, Y.Jin, G. Chattopadhyay, I. Mehdi, G. Beaudin, C. R. Physique 11 (2010) M.K. Hudait, K.P. Venkateswarlu, S.B. Krupanidhi, Solid State Electron 45 (2001) M. Soylu, F. Yakuphanoglu, Thin Solid Films 519 (2011) S. Asubay, O. Gullu, A. Turut, Vacuum 83 (2009) E.H. Rhoderick, R.H.Williams, Metal Semiconductor Contacts, Oxford, Clerendon, W. Mönch, J. Vac. Sci. Technol. B 17 (1999) 7. S. Chand, S. Bala, Phys B 390 (2007) C. Nuhoglu, Y. Gulen, Vacuum 84 (2010) S. Karatas, A. Turut, Physica B 381 (2006) S. Alt ndal, I. Yucedag, A. Tataroglu, Vacuum 84 (2010) B. Sahin, H. Cetin, E. Ayyildiz, Solid State Commun. 135 (2005) O Pakma, N Serin, T Serin, S Alt ndal, Semicond. Sci. Technol. 23 (2008) G. Guler, Ö. Gullu, Ö.F. Bakkaloglu, A. Turut, Physica B 403 (2008) Y.S. Ocak, M.F. Genisel, T. Kilicoglu, Microelectron. Eng. 87 (2010) B. Tatar, A.E. Bulgurcuo lu, P. Gökdemir, P. Aydogan, D. Y lmazer, O. Özdemir, K. Kutlu, Int. J. Hydrogen Energy 34 (2009) W.T. Yen, Y.C. Lin, P.C. Yao, J.H. Ke, Y.L. Chen, Appl. Surf. Sci 256 (2010) Y.C. Lin, J.Y. Li, W.T. Yen, Appl. Surf. Sci. 254 (2008) S.K. Cheung, N.W. Cheung, Appl. Phys. Lett. 49 (1986) H. Norde, J. Appl. Phys. 50 (1979) O. Pakma, N.Serin, T.Serin, S. Alt ndal, Physica B 406 (2011) H.C. Card, E.H. Rhoderick, J. Phys. D 4 (1971) M.K. Hudait, S.B. Kruppanidhi, Solid State Electron 44 (2000) E.H. Nicollian, J.R. Brews, MOS (Metal Oxide Semiconductor) Physics and Technology, Wiley, New York, A. Turut, N. Yalcin, M. Saglam, Solid State Electron 35 (1992) S. Aydogan, U. Incekara, A.R. Deniz, A. Turut, Microelectronic Engineering 87 (2010) B. Akkal, Z. Benamara, B. Gruzza, L. Bideux, Vacuum 57 (2000) M.Okutan, E. Basaran, F. Yakuphanoglu, Appl. Surf. Sci. 252 (2005) S. Aydo an, U. Incekara, A. Turut, Thin Solid Films 518 (2010)
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